Contactless measurements of resistivity of semiconductor wafers employing single-post and split-post dielectric-resonator techniques

Krupka, Jerzy, and Mazierska, Janina (2007) Contactless measurements of resistivity of semiconductor wafers employing single-post and split-post dielectric-resonator techniques. IEEE Transactions on Instrumentation and Measurement, 56 (5). pp. 1839-1844.

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DOI: 10.1109/TIM.2007.903647

View at Publisher Website: http://dx.doi.org/10.1109/TIM.2007.90364...

Abstract

Complementary single- and split-post dielectric- resonator techniques were used for contactless absolute resistivity measurements of semiconductor wafers and for onwafer resistivity mapping in the range of 10^-5 to 10^5 Omega ldr cm. Uncertainties of the resistivity measurements employing both techniques are in the range of 2%-4%. Permittivities of high-resistivity semiconductors were measured with uncertainties of approximately 0.5%. Several Silicon, GaAs, and SiC wafers were tested at room and at elevating temperatures, showing excellent repeatability of measurements.

ID Code:2585
Item Type:Article (Refereed Research - C1)
Keywords:conductivity measurement; contactless measurements; resistivity mapping; semiconductor material measurements; SiC; silicon
FoR Codes:09 ENGINEERING > 0906 Electrical and Electronic Engineering > 090699 Electrical and Electronic Engineering not elsewhere classified @ 100%
SEO Codes:86 MANUFACTURING > 8616 Computer Hardware and Electronic Equipment > 861603 Integrated Circuits and Devices @ 100%
Deposited On:24 Jul 2009 12:24
Last Modified:24 May 2013 00:28
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