Acid mist and bubble size correlation in copper electrowinning

Abstract

The average bubble size and the amount of acid mist generated during copper electrowinning were measured under a variety of operating conditions. In the absence of surfactants, the amount of generated acid mist decreased as the average bubble size increased. In contrast, in the presence of FC-1100, a surfactant typically used to supress acid mist, acid mist showed little correlation with the average bubble size. The significant change in the bubble burst mechanism, due to the presence of surfactant molecules in the solution/air interface, is believed to be the reason for the suppression of the effect of bubble size on acid mist.