Low loss dielectric materials for high frequency applications
Jacob, Mohan (2009) Low loss dielectric materials for high frequency applications. International Journal of Modern Physics B, 23 (17). pp. 3649-3654.
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The microwave properties of some of the low cost materials which can be used in high frequency applications with low transmission losses are investigated in this paper. One of the most accurate microwave characterization techniques, Split Post Dielectric Resonator technique (SPDR) is used for the experimental investigation. The dielectric constants of the 3 materials scrutinized at room temperature and at 10K are 3.65, 2.42, 3.61 and 3.58, 2.48, 3.59 respectively. The corresponding loss tangent values are 0.00370, 0.0015, 0.0042 and 0.0025, 0.0009, 0.0025. The high frequency transmission losses are comparable with many of the conventional materials used in low temperature electronics and hence these materials could be implemented in such applications.
|Item Type:||Article (Refereed Research - C1)|
|Keywords:||microwave characterization; low temperature electronics; dielectric materials|
|FoR Codes:||09 ENGINEERING > 0912 Materials Engineering > 091208 Organic Semiconductors @ 100%|
|SEO Codes:||97 EXPANDING KNOWLEDGE > 970109 Expanding Knowledge in Engineering @ 100%|
|Deposited On:||18 May 2010 11:01|
|Last Modified:||23 May 2013 01:17|
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|Citation Counts with External Providers:||Web of Science: 0|
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