Electrodeposition of composite copper/liquid-containing microcapsule coatings
Zhu, Liqun, Zhang, Wei, Liu, Feng, and He, Yinghe (2004) Electrodeposition of composite copper/liquid-containing microcapsule coatings. Journal of Materials Science, 39 (2). pp. 495-499.
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This paper presents results on the preparation of microcapsules containing liquid organosilica, and their co-deposition with copper in an acidic copper electrolyte onto a carbon steel cathode to form a copper/microcapsule composite coating. Microscopic analyses of the surface and the cross-section of the coating confirm the incorporation of the liquid-containing microcapsules in the coating layer. The influence of microcapsules in the electrolyte on the cathode polarization, as well as that of process conditions on the microcapsule inclusion, is also discussed.
|Item Type:||Article (Refereed Research - C1)|
|FoR Codes:||09 ENGINEERING > 0912 Materials Engineering > 091202 Composite and Hybrid Materials @ 100%|
|SEO Codes:||86 MANUFACTURING > 8612 Fabricated Metal Products > 861201 Coated Metal and Metal-Coated Products @ 100%|
|Deposited On:||12 Apr 2010 09:56|
|Last Modified:||12 Feb 2011 22:59|
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